產(chǎn)品介紹
Underfill導(dǎo)熱膠_ASEC低溫焊接專用底填膠39-ICH08
ASEC Underfill導(dǎo)熱膠39-ICH08_適用于低溫焊接封裝。該膠水為平衡固化劑。有可能獲得低CTE和低溫度固化的特性。
Underfill導(dǎo)熱膠_ASEC膠水39-ICH08特點(diǎn)：
Liquid state
Property Typical Value Test Condition
Chemical Epoxy (Black)
Specific Gravity @25度
Thixotropic index 12s-1/120s-1
Viscosity mPa·s Cone plate type, 120s-1
Cured state
Property Typical Value Test Condition
Tensile Modulus Gpa 25度, DMA
Tg 120度 DMS
CTE α1/α2 39/105 ppm/度 TMA
Dielectric constant GHz
Dielectric loss tangent GHz
Underfill導(dǎo)熱膠_ASEC低溫焊接專用底填膠39-ICH08相關(guān)產(chǎn)品：
衡鵬供應(yīng)
ASEC 39-ICH09_Underfill導(dǎo)熱膠/散熱膠/導(dǎo)熱底填膠/散熱底填膠/低溫焊接專用底填膠/低溫焊接底填膠/SnBi合金焊接專用底填膠/SnBiAg合金焊接專用Underfill膠水
